Manufacturing Method of ITO Sputtering Target

Author:Manufacturing Method of ITO Sputtering Target     Date Posted:10 Feb 2023

Manufacturing Method of ITO Sputtering Target


Vacuum hot pressing

Vacuum hot pressing uses heat and mechanical energy to densify ITO powder, and can produce high-density ITO ceramic targets with a density of 91% to 96%. This method can easily obtain ITO targets with a density close to the expected density and a porosity close to zero. However, limited by the size of equipment and molds, vacuum hot pressing has less advantages in preparing large-size sputtering targets.

 

Hot isostatic pressing

Hot isostatic pressing (HIP) prepares ITO sputtering targets by sintering under pressure or pressing at elevated temperatures. Similar to vacuum hot pressing, HIP can obtain products with high density (almost theoretical density) and excellent physical and mechanical properties under heating and pressing. But it is also limited by equipment pressure and cylinder size.

 

Normal temperature sintering

Room temperature sintering is to prepare a high-density target preform by slurry casting or pre-pressing, and then sinter under a certain atmosphere and temperature to obtain an ITO target. Its biggest advantage lies in the ability to produce large-sized sputtering targets. However, compared with other sintering methods, the purity of the targets produced by this method is lower.

 

Cold isostatic pressing

Cold isostatic pressing (CIP) uses rubber or plastic as the covering material at room temperature, and uses liquid as the pressure medium to transmit ultra-high pressure. CIP can also prepare larger-sized ITO sputtering targets. And cheap, suitable for mass production. However, CIP requires the material to be sintered at a high temperature of 1500-1600°C in a pure oxygen environment of 0.1-0.9 MPa, which has a high risk.


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