Cold Isostatic Pressing of Target Molding
What is target
The target is a sputtering source that forms various functional films on the substrate by magnetron sputtering, multi-arc ion plating or other coating systems under appropriate technological conditions. To put it simply, the target is the target material of high-speed charged particles bombardment. Used in high energy laser weapons, different power density, different output waveform, different wavelength laser and different target interaction, will produce different killing and destruction effects. For example, evaporation magnetron sputtering coating is heated evaporation coating, aluminum film, etc. Replace different targets (such as aluminum, copper, stainless steel, titanium, nickel target, etc.), you can get different film systems (such as super hard, wear-resistant, anti-corrosion alloy film, etc.).
The application of target
1. For display
Target are widely used in flat screen display (FPD). In recent years, the application rate of flat display in the market is increasing year by year, which also drives the technology and market demand of ITO target. There are two ITO targets, one is indium tin alloy target, and the other is sintered by mixing indium oxide and tin oxide powder in nano state.
2. For microelectronics
Target material is also used in the semiconductor industry, relatively speaking, the semiconductor industry for target sputtering film quality requirements are relatively harsh. Twelve inch (300 axis) silicon is being made, but the width of the interconnect is decreasing. At present, the requirements of silicon wafer manufacturers for targets are large size, high purity, low segregation and fine grain, etc., the quality requirements are relatively high, which requires that the target needs to have a better microstructure.
3. For storage technology
The storage technology industry has a great demand for target materials.The TbFeCo alloy target required for the magnetic disc is still being further developed, and the magnetic disc produced with it has the characteristics of long service life, large storage capacity and repeated contactless erasable.
The cold isostatic pressing method is to put the pre-formed china into a rubber jacket and immerse it in a high-pressure liquid so that it is subjected to isotropic pressure to realize the enhancement of the density of the china. Cold isostatic pressing is only to obtain a green body with the highest possible density, which makes the sintering and densification of the green body easier. Since cold isostatic pressing does not have the sintering ability of hot isostatic pressing, an independent sintering process is required to sinter the green body.
Cold isostatic pressing can suppress large-sized targets, and is currently the preferred molding method for most companies. Forming studies at home and abroad have shown that cold isostatic pressing can produce high-quality green bodies that meet the needs of ceramic targets. However, when cold isostatic pressing is used to form super-sized green bodies, the equipment investment is very expensive due to the limitation of the chamber size, and there is a deformation problem when the green bodies are thin and large in size. At the same time, when pressing green bodies of different sizes, it is necessary to prepare pre-pressing molds of different specifications, and the cost of the molds is relatively high.
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